On September 3, Montage Technology issued a statement detailing its investor relations activities. The company has pioneered the trial production of CXL3.2 MXC chips in July, successfully integrating them into the next-generation CXL products of Samsung and SK Hynix. It is anticipated that 2027 will mark the inaugural year of widespread commercial deployment for CXL technology. Meanwhile, the PCIe Switch chip is on track to achieve engineering sample tape-out within the current year. The PCIe6.x/CXL3.x Retimer chip has already completed tape-out for its mass production version and has earned a spot on the PCI-SIG supplier list.

Furthermore, Montage Technology plans to finalize the tape-out of engineering samples for both the PCIe7.0 Retimer and Ethernet PHY Retimer chips by the end of this year. The DDR5 sixth-generation RCD chip has commenced sampling, boasting support for speeds up to 9200MT/s. The fifth-generation chip has initiated mass shipments, with the combined shipments of the third and fourth generations surpassing the 50% mark. The second-generation MRCD/MDB chips are currently undergoing large-scale trial usage, with expectations to commence high-volume production next year, following the mass production of the new generation CPU.

Additionally, the clock chip has secured mass production orders, and the high-precision RTC chip is projected to complete engineering sample tape-out in the latter half of the year. With the rising proportion of AI server CPU configurations, there is a corresponding increase in demand for memory modules and interconnect chips.