The 2026 World Artificial Intelligence Conference (WAIC) took place in Shanghai, where Oriental Computing Core made a groundbreaking debut of the DF1000—the world's inaugural software-defined near-memory computing 3D AI chip. This remarkable innovation earned the company the prestigious 2026 SAIL Award for 'Outstanding AI Leadership.' Built upon well-established domestic technology, the DF1000 integrates 'software-defined + 3D stacked near-memory computing' technology. By leveraging DRAM-LOGIC wafer-level hybrid bonding and 3D vertical packaging techniques, it achieves a significant milestone: developing a cutting-edge AI computing chip that delivers performance on par with a 4nm process, all while utilizing a mature, domestically produced 14nm+ manufacturing process. Presently, the chip has successfully undergone validation, demonstrating stable and full-function operation within a large-scale 128-card cluster.