ASML revealed that Intel Foundry has adeptly harnessed its High Numerical Aperture (High NA) Extreme Ultraviolet (EUV) lithography technology to ramp up the mass production of specific Core Ultra 3 series processors at the Intel 18A process node. This feat positions Intel as the inaugural company globally to achieve high-volume shipments of logic chips utilizing this cutting-edge technology. Both entities confirmed the dual certification of this technology for particular process layers within the Intel 18A framework, with yields matching those of the established NXE EUV platform. Moreover, they have outlined plans for its broader application in forthcoming process nodes.

In 2024, the two companies successfully integrated the industry's premier commercial High NA EUV lithography system in Oregon, USA. Intel has distinguished itself as the first enterprise to install and successfully pass the acceptance test for the second-generation TWINSCAN EXE:5200B system. Furthermore, TSMC Chairman Mark Liu dispelled rumors suggesting the company's disinterest in investing in High-NA EUV equipment. He clarified that while the equipment has indeed been procured, its deployment in mass production has been postponed due to substantial costs. Currently, concerted efforts are being made to curtail expenses and optimize the equipment's advantages.