TSMC’s CoWoS advanced packaging facility, located at the first-phase site of Chiayi Science Park, initiated mass production in June this year. On July 12, the groundbreaking ceremony for the park’s second-phase base took place. Spanning roughly 90 hectares, this new phase is being developed under TSMC’s leadership to foster an industrial cluster focused on advanced packaging technologies. Plans are also underway for the construction of a third and fourth plant, with provisions for additional expansion in the future.
