On July 4, Micron Technology commenced the expansion of its wafer fab in Hiroshima, Japan, with a total investment of approximately 1.5 trillion yen (about $9.3 billion). The project aims to produce advanced memory chips such as HBM to meet the demand for AI processors, with shipments expected to begin in the summer of 2028. Japan's Ministry of Economy, Trade and Industry will provide subsidies of up to approximately 500 billion yen. This project is part of Micron's global AI memory capacity expansion plan. Meanwhile, Micron is also advancing large-scale advanced process investments in Idaho and New York in the United States to enhance DRAM and HBM supply capabilities.
