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Huatai Securities has pointed out that the soaring demand for AI computing chips, compounded by the constrained supply of existing packaging materials, is fueling a transition toward advanced packaging solutions that incorporate new materials such as glass, ceramics, and M8/M9 grade PCBs. Owing to their high hardness, these materials render traditional processing methods less effective. Ultra-fast lasers, characterized by their cold processing capabilities, have emerged as the optimal solution for precision machining. At present, the landscape presents a golden opportunity for import substitution, with equipment manufacturers that offer viable product solutions poised to reap sustained benefits. The future of the ultra-fast laser equipment industry looks exceedingly promising.
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