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The surge in demand for high-bandwidth memory, propelled by the artificial intelligence boom, is reaching fever pitch. Samsung Electronics, the South Korean tech giant, is set to construct a state-of-the-art semiconductor packaging plant in Gwangju City, a strategic move aimed at fortifying its AI chip supply chain network. This significant investment is anticipated to be unveiled during the presidential discussions scheduled for June 29. Should the project come to fruition, Samsung is poised to further ramp up its investments in the advanced packaging domain. Presently, Samsung is actively bolstering its presence in the HBM market, vying for the top spot in the industry, and boasting a clientele that includes AI powerhouses such as NVIDIA, AMD, and Google.
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