Maxic Semiconductor Unveils Long-Distance, High-Precision DTOF LiDAR Receiver SOC Chip, Bolstering Mid-to-Long-Range Ranging Market
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Author:小编   

On April 17, 2026, Maxic Semiconductor (Beijing) Co., Ltd. introduced its latest innovation—the long-distance, high-precision DTOF LiDAR receiver SOC chip, the MT3806. This cutting-edge chip is tailored for mid-to-long-range, high-precision ranging applications that demand robust resistance to ambient light interference. It finds versatile applications in devices such as robotic vacuum cleaners, lawn-mowing robots, pool-cleaning robots, service robots, and handheld rangefinders, offering crucial support for enhancing the spatial perception capabilities of intelligent devices.

Leveraging Single-Photon Avalanche Diode (SPAD) technology, the MT3806 chip integrates a high-sensitivity SPAD array, a high-precision Time-to-Digital Converter (TDC), an intelligent histogram processing engine, and a multi-peak multi-line array detection algorithm. This integration enables full-link processing, from photon detection to distance calculation, all on a single chip, eliminating the need for additional peripherals and thereby lowering the entry barrier for device development.

The chip's default ranging capability spans from 0.02 meters to 15 meters, with the flexibility to extend up to 60 meters through optional configurations. Housed in a compact OLGA28 package and equipped with an integrated anti-multi-device interference coding module, the MT3806 effectively mitigates external laser crosstalk and environmental interference, ensuring stable ranging performance even in scenarios where multiple devices operate in parallel.