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According to the most recent research conducted by TrendForce, artificial intelligence (AI) - driven high - performance computing (HPC) heavily depends on advanced packaging technologies to fulfill the requirements of heterogeneous integration. Among these technologies, TSMC's CoWoS (Chip - on - Wafer - on - Substrate) stands out as a crucial solution.
However, the landscape is evolving. As cloud service providers (CSPs) ramp up the development of their proprietary application - specific integrated circuits (ASICs), there's an escalating demand for larger packaging areas. This is essential to integrate increasingly complex functional chips.
Consequently, some CSPs are now contemplating a switch from TSMC's CoWoS solution to Intel's EMIB (Embedded Multi - Die Interconnect Bridge) technology.
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