Towards the end of 2024, Micron Technology embarked on its first - ever recruitment of university graduates in South Korea. Additionally, it was on the lookout for Korean engineers to staff its Hiroshima plant in Japan. The company further intends to broaden its recruitment scope to encompass its HBM packaging plant in Singapore.

This strategic move is designed to cater to the burgeoning demand in the AI memory market and to go head - to - head with industry giants Samsung Electronics and SK Hynix. It also underscores the pivotal role that HBM plays in the realm of AI semiconductors. Micron Technology is in the midst of a vigorous expansion of its technical workforce. A significant majority of the positions being filled are directly related to HBM R&D and cutting - edge advanced packaging processes.

Domestic firms in South Korea are apprehensive that this talent exodus could potentially undermine the competitiveness of their semiconductor industry. Moreover, Micron Technology's recruitment approach might act as a trigger, prompting overseas companies to adopt similar strategies.