Reports indicate that Samsung Electronics and SK Hynix have established an ambitious objective: to wrap up the research and development (R&D) of HBM4E within the first half of 2026. HBM4E is slated for integration into the cutting - edge artificial intelligence (AI) accelerators of global tech behemoths. For instance, it will be used in the top - tier R300 version of NVIDIA's Rubin platform. The AI accelerators outfitted with HBM4E are anticipated to hit the market in 2027. In light of this, both companies are stepping up their R&D initiatives and are making every effort to complete quality verification in the latter half of 2026.
