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ESWIN Material's Patent 'A Method, Apparatus, Equipment, and Medium for Identifying Linear Defects in Wafers' Granted
2025-11-05 /
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Author：小编
According to Tianyancha, Xi'an ESWIN Material Technology Co., Ltd. recently obtained an invention patent authorization for a technology named 'A Method, Apparatus, Equipment, and Medium for Identifying Linear Defects in Wafers,' with the authorization announcement number CN119812025B. The authorization announcement date is October 14, 2025, and the application date is December 5, 2024.
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