On November 4, 2025, during the SK Group AI Summit in Seoul, South Korea, SK Hynix rolled out its memory technology roadmap spanning from 2026 to 2031. The roadmap encompasses the introduction of innovative products, including 16 - layer stacked HBM4 memory, LPDDR6, and NAND with over 400 layers of stacking.

SK Hynix also delineated three key development avenues. Firstly, there's AI - D O, which emphasizes low power consumption while delivering high performance. Secondly, AI - D B comes with integrated computing capabilities, opening up new possibilities in data processing. Thirdly, AI - D E aims to broaden the application scope of memory technologies.

Moreover, the company intends to incorporate protocols and controllers directly into the HBM base die. This strategic move is set to cut down on power consumption and create more room for computing units, thereby enhancing overall system efficiency.