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On October 15, during the Bay Area Semiconductor Industry Eco-Expo 2025, Shanghai XS Micro Technology Co., Ltd. took the stage to present its latest lineup of cutting-edge equipment. This included a brand-new compound semiconductor lithography machine, laser annealing equipment, advanced wafer packaging metrology and inspection tools, an advanced wafer packaging lithography machine, as well as comprehensive bonding equipment solutions. As explained by the staff at the exhibition booth, XS Micro was established in February of this year. Its core team members and technical resources are derived from Shanghai Micro Electronics Group (SMEG). While XS Micro is dedicated to developing equipment that can swiftly enter the commercial market, SMEG continues to concentrate on the research and development of front-end core equipment.
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