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Gilad Shainer, SVP of Networking at NVIDIA, discusses critical innovations in data center infrastructure designed to maximize power efficiency and performance in AI factories. He explores how NVIDIA addresses the growing demands of AI workloads through advances in cooling technology, optical networking, and pluggable connectivity standards.

– How liquid cooling and 800-volt rack systems improve power efficiency and compute density
– The power and resiliency benefits of co-package optics technology in scale-out and scale-up networks
– Why pluggable optics infrastructure remains essential for certain applications
– Details about USFP, a new 400 Gig pluggable optical standard developed with industry partners
– How next-generation connectivity solutions balance performance, power density, and thermal management

Shainer reveals NVIDIA’s production deployment of photonics technology and explains the company’s strategic approach to optimizing tokens per watt while maintaining infrastructure reliability.

CHAPTERS:
0:00:00 – Power Efficiency and Cooling Infrastructure Optimization
0:00:39 – Co-Package Optics: Improving Network Power and Resiliency
0:01:41 – Scaling Co-Package Optics Beyond Scale-Out Networks
0:02:01 – The Continued Role of Pluggable Optics Infrastructure
0:02:27 – Introducing USFP: Next-Generation 400 Gig Pluggable Standard
0:02:55 – USFP Technical Advantages and Liquid Cooling Design

Want to be involved our video series? Contact info@nextgeninfra.io
https://ngi.fyi/ocp26-nvidia-gilad