On September 11, Morgan Stanley pointed out that despite market expectations of a slowdown in data center investments, demand for advanced chip packaging remains robust. It is projected that the growth of AI semiconductor suppliers will continue until 2028, outpacing the broader cloud spending growth. The bank forecasts that total advanced packaging capacity will increase by approximately 50% by 2028, while capital expenditures by cloud service providers will see a more moderate increase of only 12%. The growing demand for larger AI chip designs and advanced packaging for CPUs and network processors is expected to support this growth. Meanwhile, supply chain research indicates that TSMC and its partners will continue to expand their capacity. Additionally, the report suggests that AI custom chip activities will remain strong, driven by new industry partnerships and inference-related deployments.