
Thermaltake.com
Thermaltake has introduced a coordinated 14-product workstation platform in Japan, including all-in-one liquid coolers explicitly supporting AMD's SP6 socket — the processor interface used by EPYC Siena chips increasingly deployed in on-premises AI inference nodes — alongside sTR5, LGA4677, and LGA4710. This socket coverage extends consumer-channel AIO options to builders running server-class workstation CPUs who have historically needed custom water loops. All 14 products — covering full-tower cases, modular expansion pedestals, and AIO coolers — go on sale in Japan through distributor Ask Corporation on September 11, 2026.
The signal embedded in that socket list matters for AI infrastructure builders. Consumer-market AIO coolers have historically targeted LGA1700 and AM5 — the sockets found in gaming and prosumer systems. The AW360 and AW420 additionally support LGA4677, LGA4710, sTR5, and SP6. That extension means a developer running EPYC Siena or Threadripper PRO 9000-series hardware in a workstation chassis now has a consumer-channel AIO path — without commissioning a custom water loop.
Thermaltake's broader lineup pairs these coolers with a modular case ecosystem designed for incremental AI infrastructure buildout: a dual-system full tower, stackable expansion pedestals, and a range of single-system towers. The combined platform targets small-scale AI inference operators who want workstation-chassis flexibility rather than 1U or 2U rack hardware.
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Supporting a new CPU socket in an AIO cooler is not a simple checkbox. Every socket requires a physically correct cold plate geometry to achieve adequate contact coverage across the processor's die array, along with a matched mounting bracket and backplate designed for the socket's retention mechanism. AMD SP6 — the socket used by EPYC Siena (up to 64 cores, designed for edge and infrastructure deployment) — has a distinct land-grid array pattern and a smaller footprint than SP5 but still requires specific mounting hardware beyond consumer socket designs. AMD sTR5, used by Threadripper PRO 7000- and 9000-series processors, carries similar requirements.
Intel's LGA4677 (used by Xeon Scalable Sapphire Rapids and Emerald Rapids) and LGA4710 (used by Xeon Scalable Granite Rapids) present equivalent engineering challenges. Consumer AIO manufacturers typically do not develop mounting solutions for these sockets because the addressable market — workstation and server builders who require liquid cooling without a custom loop — has historically been served by rack-mount coolers or custom loops assembled by system integrators.
Thermaltake's decision to include all four of these sockets in the AW360 and AW420 suggests the company has identified a market segment that consumer-channel thermal products have not universally addressed: small-scale AI inference operators who want the simplicity of an AIO, the TDP headroom of EPYC or Threadripper PRO, and the enclosure flexibility of a workstation chassis rather than a 1U or 2U rack unit.
Both AIO models use Thermaltake's TOUGHFAN Pro fans — the high-static-pressure variant in its fan lineup, designed specifically for radiator and restricted-airflow applications where impedance from dense fin stacks makes airflow-optimized fans ineffective. The AW360 carries a 360mm radiator with three TOUGHFAN 12 Pro fans rated at 590W TDP; the AW420 carries a 420mm radiator with three TOUGHFAN 14 Pro fans rated at 625W TDP — the larger of the two formats and the appropriate choice for CPUs running at or near their maximum TDP continuously. The AW360 is priced at ¥74,980 (approximately $488) and the AW420 at ¥79,980 (approximately $521).
The flagship case in the lineup is the AX1000 TG, a dual-system full-tower chassis built for operators who need to run two independent computing environments inside a single enclosure. The AX1000 TG supports XL-ATX and SSI-EEB motherboards — SSI-EEB being the largest standard server board format (305mm × 330mm) used in dual-socket server platforms including those from Supermicro and ASUSTeK.
The dual-system capability is architecturally relevant to AI development workflows where a separation between a production inference environment and a development or fine-tuning environment is operationally preferred. Running both on shared hardware reduces physical footprint and allows a single power delivery infrastructure to serve both systems, which matters particularly when the workstation is connected to a dedicated 240V circuit to support multiple high-TDP GPUs.
The AX1000 TG Black is priced at ¥118,000 (approximately $769); the AX1000 TG Snow (white colorway) at ¥119,800 (approximately $780). Thermaltake previewed the AX1000 TG at CES 2026 in January with a projected US retail price of $899.99, indicating the Japan-market pricing at current exchange rates is somewhat below the projected US MSRP.
One of the more practically useful elements of the AX-series lineup for AI infrastructure operators is the modular pedestal architecture. The AX200 is a dedicated expansion unit designed to attach above or below the AX1000 TG; the AX100 serves the same function for the AX700 TG and AX700 chassis.
The operational significance: an AI inference node assembled today with a specific GPU count can be physically expanded without replacing the primary enclosure. The AX200 adds mounting space for additional power supply units, storage drives, cooling fans, and radiators — hardware that an operator may not need on day one but may require as model sizes scale up or as additional inference capacity is added to the same node. This incremental expansion model reduces the upfront capital commitment of building for maximum-capacity hardware at initial deployment.
The AX200 Black is priced at ¥48,800 (approximately $318); the AX200 Snow at ¥49,800 (approximately $324). The AX100 Black starts at ¥28,800 (approximately $188); the AX100 Snow at ¥29,800 (approximately $194). According to Guru3D's coverage of the AX700 family, the combined AX700 + AX100 stacking configuration enables a 560mm DIY liquid cooling radiator — a mounting footprint not achievable in the AX700 alone. Guru3D also notes that radiator compatibility claims describe individual limits, not simultaneously achievable combinations — radiator thickness, fan depth, and nearby component height can reduce usable space below the headline specification.
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The AX700 TG and AX700 are single-system full-tower cases sharing the same stacking compatibility with the AX100 pedestal. The primary distinction between the two is panel material: the AX700 TG uses a tempered glass side panel, while the AX700 uses steel throughout — a configuration that prioritizes enclosure rigidity and durability over interior visibility, more appropriate for environments where aesthetics are secondary to structural reliability under continuous load. Both are priced at ¥68,800 to ¥69,800 (approximately $448 to $455) depending on colorway.
The AX500, the most accessible case in the lineup at ¥32,800 to ¥33,800 (approximately $214 to $220), includes native compatibility with rear-connector motherboards — boards that relocate primary power, USB, and front-panel connectors to the PCB's back face for cleaner cable routing. This makes the AX500 relevant to builders using ASUS BTF, MSI Project Zero, or GIGABYTE Project Stealth motherboards, a growing segment of the enthusiast market where cable management is a primary design priority.
The AW-series coolers require no special electrical infrastructure — they draw standard ATX power from the system's PSU. The cases are passive enclosures. However, for AI inference builders assembling multi-GPU systems in the AX1000 TG or AX700 families, the power delivery question is separate and significant: a workstation running three or four high-TDP GPUs will require a dedicated 240V circuit if the PSU exceeds approximately 2,400W. That electrical constraint applies to the build as a whole, not to the Thermaltake products specifically. Builders planning this class of system should verify their site's electrical capacity before selecting a PSU.
Thermaltake has maintained a sustained retail presence in Japan through Ask Corporation, which distributes a broad range of Western and Taiwanese hardware brands into Japanese specialty channels. Thermaltake's press release states the company has received the BCN Award in the PC case category for eight consecutive years — a Japanese retail industry award based on point-of-sale data — though this claim appears in Thermaltake's own promotional materials and has not been independently verified.
No international release dates or pricing outside Japan have been announced for this product family as of this article's publication. Builders in North America can reference the CES 2026 US pricing previewed by Overclock3D (AX1000 TG at $899.99 and AX200 at $299.99) as a rough guide, though final US retail pricing may differ.
| Product | Type | Price (JPY) | Approx. USD |
|---|---|---|---|
AX1000 TG Black | Full-tower case | ¥118,000 | ~$769 |
AX1000 TG Snow | Full-tower case | ¥119,800 | ~$780 |
AX700 TG Black | Full-tower case | ¥68,800 | ~$448 |
AX700 TG Snow | Full-tower case | ¥69,800 | ~$455 |
AX700 Black | Full-tower case | ¥68,800 | ~$448 |
AX700 Snow | Full-tower case | ¥69,800 | ~$455 |
AX500 Black | Full-tower case | ¥32,800 | ~$214 |
AX500 Snow | Full-tower case | ¥33,800 | ~$220 |
AX200 Black | Expansion unit | ¥48,800 | ~$318 |
AX200 Snow | Expansion unit | ¥49,800 | ~$324 |
AX100 Black | Expansion unit | ¥28,800 | ~$188 |
AX100 Snow | Expansion unit | ¥29,800 | ~$194 |
AW360 | AIO cooler (360mm) | ¥74,980 | ~$488 |
AW420 | AIO cooler (420mm) | ¥79,980 | ~$521 |
All products will go on sale in Japan on September 11, 2026.
All USD pricing figures in this article are conversions from Japanese yen at the September 9, 2026 mid-market rate of approximately 153.5 JPY per dollar and may not reflect final pricing in other markets.
The AW360 and AW420 support AMD sTR5 (used by Threadripper PRO 7000- and 9000-series processors) and AMD SP6 (used by EPYC Siena) on the AMD side, and Intel LGA4677 (Xeon Scalable Sapphire Rapids and Emerald Rapids) and LGA4710 (Xeon Scalable Granite Rapids) on the Intel side. Consumer sockets including AM5 and LGA1700 are also supported by the AW-series coolers. This is broader socket coverage than most consumer-market AIO coolers, which typically stop at AM5 and LGA1700 without extending to server-class workstation platforms.
The AX200 is a dedicated pedestal module that attaches to the top or bottom of an AX1000 TG chassis, adding mounting space for additional power supply units, storage drives, cooling fans, and radiators. Whether you need one depends on your build's GPU count and storage requirements. A single-GPU workstation will generally fit within the AX1000 TG without an expansion unit. Operators planning to add GPU capacity incrementally — a common pattern as AI model sizes grow and inference demands scale — may prefer to purchase the AX200 alongside the case so expansion remains available without a chassis replacement later.
Yes. Thermaltake's press release and product documentation confirm the AX500 is compatible with rear-connector motherboard designs, which includes ASUS BTF, MSI Project Zero, and GIGABYTE Project Stealth. These platforms relocate power, USB, and front-panel connectors to the back of the PCB, requiring case-side cutouts that align with each board's connector positions. Builders choosing the AX500 for a back-connect build should verify compatibility for their specific motherboard against Thermaltake's published compatibility list before purchasing.
As of September 9, 2026, Thermaltake and Ask Corporation have not announced release dates or pricing for any market outside Japan. The AX1000 TG was previewed at CES 2026 in January with a projected US retail price of $899.99, but no formal North American launch date has been set. Buyers outside Japan should check their regional Thermaltake distributor for availability information. All USD pricing figures in this article are conversions from Japanese yen at the September 9, 2026 mid-market rate of approximately 153.5 JPY per dollar and may not reflect final pricing in other markets.
