A research report from Huatai Securities highlights that during its 2026 Autumn Strategy Conference, held from September 2 to 3, in-depth discussions were conducted on the sub-segments within the AI computing power infrastructure landscape. Huatai Securities notes that the expansion of AI computing power construction is driving industrial competition beyond individual accelerators, extending into system-level segments such as materials, interconnection technologies, general-purpose computing, and advanced packaging.

Specifically, the iterative development of 800G and 1.6T optical modules has spurred demand for active optical chips. The performance attributes of InP (Indium Phosphide) substrates—including their high specifications, yield rates, and reliable delivery capabilities—have become increasingly vital. Consequently, the domestic supply chain is accelerating its validation and adoption processes for these substrates.

Moreover, the demand for optical fibers in AI data centers has surged significantly. Given the lengthy expansion cycle associated with optical fiber preforms, there is a potential for tightening supply and demand dynamics for high-performance optical fibers. In response, emerging technologies such as hollow-core fibers are experiencing accelerated development.

Furthermore, the continuous planning, tool invocation, and multi-task coordination capabilities of intelligent agents have underscored the value of CPU orchestration and scheduling. The transition from large-size, high-density packaging to glass substrates has unlocked new application opportunities for the latter. Moving forward, mass production capabilities will emerge as a critical determinant influencing the pace of industrialization in this domain.