At the 2026 World Artificial Intelligence Conference, Enflame Technology made three groundbreaking announcements. Firstly, in partnership with ZTE, the company introduced the YunSui ESL64-O SuperNode. This innovative solution boasts four pivotal capabilities designed to revolutionize intelligent computing paradigms and establish a seamless, end-to-end commercial closed loop. Secondly, Enflame Technology, in collaboration with Xianfeng Technology, unveiled a CoPoS panel-level advanced packaging sample that is fully compatible with AI computing chips. This achievement represents the first-ever integration of Enflame's self-developed high-end AI computing chip with domestically produced CoPoS packaging technology, marking a significant milestone in the industry. Thirdly, in conjunction with Xingji Tiansuan, Enflame Technology presented the 'Xingji Tiansuan Space-Based Computing Application Scenarios.' This initiative involves the construction of a distributed three-dimensional computing network and the breakthrough of three core technologies. Looking ahead, the company plans to offer three core computing services, providing a comprehensive demonstration of intelligent computing capabilities that span from chips to systems and from terrestrial to space-based environments.