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Recently, at the 'ZTE Full-Stack Intelligent Computing Ecosystem Forum' held during the 2026 World Artificial Intelligence Conference, ZTE proudly introduced its latest innovation—the OEX Hypernode product. Crafted with an open and modular architecture, this product seamlessly integrates with a wide array of GPU ecosystems, enabling flexible computing power configurations. Leveraging the OEX orthogonal backplane-free design, it achieves a cable-less construction, substantially cutting down on internal interconnection expenses. Concurrently, through collaborative multi-chip processing, it harnesses the full potential of clusters, thereby establishing an 'AI factory' that offers the most cost-effective total cost of ownership (TCO) over its entire operational lifespan.
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