In its latest research report, CITIC Securities highlights insights from NVIDIA's GTC 2026 conference, where it was revealed that the demand for AI computing power is projected to surge continuously through 2027. CITIC Securities' analysis indicates that the introduction of new LPU (Light Processing Unit) and midplane components in the Rubin and Rubin Ultra architectures will further fuel demand growth, owing to their enhanced specifications and broader usage. This development is expected to significantly benefit the AI PCB (Printed Circuit Board) industry. Additionally, CPO (Co-Packaged Optics) technology is slated for initial deployment in the Scale-out architecture of Rubin, with Scale-up applications anticipated to commence from the Feynman platform in 2028. CITIC Securities maintains an optimistic outlook, believing that NVIDIA's GTC 2026 conference will bolster market confidence in the AI industry's sustained growth and the realization of its incremental logic. As such, it recommends investors pay close attention to leading domestic manufacturers in the AI PCB, Copper Clad Laminate (CCL), and memory sectors.