On February 12, it was reported that the Shenzhen Municipal Bureau of Industry and Information Technology recently released the Action Plan for 'Artificial Intelligence+' Advanced Manufacturing Industry in Shenzhen (2026-2027). The plan proposes applying artificial intelligence technology to key links in the semiconductor industry chain, leveraging AI to enhance efficiency in areas such as chip design and software coding. With AI chips as a breakthrough point, the plan aims to strengthen the semiconductor industry by developing high-performance, energy-efficient dedicated SoC main control chips tailored to the terminal demands of AI phones, AI glasses, and intelligent robots, while also supporting new architecture processors such as computational storage. Additionally, for the new energy vehicle market, the plan supports the domestic substitution of 14nm and below automotive-grade advanced intelligent driving AI chips, intelligent cockpit SoC chips, and other products.