Search
iPhone 17 Pro Max's Internal Structure Revealed: Motherboard Redesigned for Enhanced Horizontal Protection
2025-08-16 /
Read about 0 minute
Author：小编
The inner workings of the iPhone 17 Pro Max have come to light, showcasing a groundbreaking horizontal redesign of the motherboard. As shared by UP master Aifengbei APP-Dean, this innovation is meticulously crafted to maximize the safeguarding of the motherboard against external bending forces. Additionally, the latest model embraces a steel-encased battery and a VC (Vapor Chamber) heat dissipation plate, both of which significantly boost its thermal management capabilities. When it comes to photography, the front camera has undergone a remarkable upgrade to 24 megapixels, while the rear triple camera system boasts an impressive 48 megapixels across all lenses. Anticipation is high for the device's release, scheduled for September.
-
C114 Communication Network -
Communication Home
7 X 24 Track global technological trends
