
A look back at Converge Digest coverage published on November 11 in earlier years.
![]() | 2025 Nebius Builds Momentum with $17–19B Microsoft Deal and $3B Meta Contract Nebius reported Q3 2025 revenue of $146.1 million, up 355% year over year, said its $17.4–$19.4 billion Microsoft AI infrastructure contract remained on track, and disclosed a new five-year, $3 billion agreement with Meta. |
![]() | 2020 OIF begins co-packaging framework IA project OIF launched a Co-Packaging Framework Implementation Agreement project to study applications and technical issues for co-packaging communication interfaces, including optics, with ASICs and to identify opportunities for interoperability standards. |
![]() | 2019 Inphi to acquire eSilicon for $226 million Inphi agreed to acquire eSilicon in a cash and debt-assumption deal, adding 2.5D packaging, SerDes and custom silicon design capabilities to its DSP, TIA, driver and silicon photonics portfolio for cloud and 5G customers. |
![]() | 2013 Xilinx Ships 20nm FPGA Xilinx announced first customer shipments of its 20nm UltraScale All Programmable devices manufactured by TSMC, targeting applications including 400G OTN, packet processing, LTE radio and data center high-performance computing. |
| Explore 25 Years of Networking History → Check out the Tech Graveyard, where the networking technologies of the past are fondly remembered |
