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RoboSense Unveils Patent for "Chip Module with Self-Test Method and LiDAR"
2025-05-15 /
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Author：小编
Shenzhen RoboSense Technologies Co., Ltd. has proudly announced a new patent, titled "Chip Module and Its Self-Test Method, as well as LiDAR," with the application publication number CN119627612A, published on March 14, 2025. This patent underscores RoboSense's pioneering advancements in intelligent sensing technology, specifically in the realm of data processing for LiDAR systems.
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