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ESWIN Publishes Patent for 'Double-Sided Grinding Device and Method'
2025-05-15 /
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Author：小编
On March 14, 2025, ESWIN Material Technology Co., Ltd. officially published its patent for the 'Double-Sided Grinding Device and Method,' with application publication number CN119609908A. This groundbreaking patent falls within the realm of semiconductor manufacturing technology, specifically targeting the challenge of silicon wafer fragmentation that often arises due to adsorption post-grinding.
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