Qizhong Technology to Raise Up to RMB 2 Billion for Multi-Chiplet Heterogeneous Integration Packaging and Testing Technology Project - Chip

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Qizhong Technology to Raise Up to RMB 2 Billion for Multi-Chiplet Heterogeneous Integration Packaging and Testing Technology Project

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Author：小编

On November 12, Qizhong Technology (688352.SH) announced plans to issue convertible bonds to unspecified targets, aiming to raise up to RMB 2 billion. After deducting issuance expenses, all proceeds will be invested in the multi-chiplet heterogeneous integration packaging and testing technology project.

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