On May 26, 2026, South Korean memory chip giant SK Hynix announced the launch of its iHBM technology. By integrating an all-in-one cooling element 'ICE' within the HBM package, this technology establishes a dedicated heat exhaust pathway directly at the D2D PHY region—where heat generation is most concentrated—reducing thermal resistance by over 30% and significantly lowering operational heat output. Leveraging the proven MR-MUF wafer-level packaging process, iHBM enables stable, large-scale mass production while maintaining high compatibility with customers' existing system-in-package environments, allowing deployment without extensive design modifications. SK Hynix plans to apply iHBM technology to next-generation products like HBM5, addressing cooling demands in ultra-high-integration, high-bandwidth applications such as high-performance computing (HPC) and AI data centers. As AI computing power requirements continue to surge, HBM enhances performance by increasing stack layers and operational speeds, but consequently faces soaring heat generation challenges. The emergence of iHBM technology provides an effective solution to this issue, promising to further elevate overall system stability and operational efficiency.