Qualcomm's newly launched top-tier chip, the Snapdragon 8 Elite Extreme Gen 6 (commonly referred to as Snapdragon 8 EE6), is manufactured using TSMC's advanced 2-nanometer process. Nevertheless, during Samsung's internal testing phase, the chip encountered overheating problems when subjected to high-load scenarios, resulting in a noticeable decline in performance. Samsung has shared these test findings with Qualcomm and has set a deadline of mid-October 2026 for the necessary enhancements to be implemented. At present, both Qualcomm and Samsung are actively engaged in refining and retesting the chip. Should the overheating issues persist without resolution, Samsung might opt to transition to its proprietary Exynos 2700 chip. It's worth noting that previously, a limited number of users experienced sporadic black screens and unexpected restarts while using the Snapdragon 8 EE6. However, these issues have been predominantly addressed through Over-The-Air (OTA) updates, without any adverse effects on the chip's overall performance.