On October 16th, Mingyi Electronics, a subsidiary under the umbrella of Sunfire New Materials, proudly announced the launch of its latest series of high-aspect-ratio gantry line plating equipment. This cutting-edge series is specifically designed to support the production of panels with an aspect ratio of 40:1 or even higher, offering a high degree of customization to cater to diverse customer requirements. The equipment seamlessly integrates with phosphor copper balls and insoluble anode systems, ensuring it meets the stringent plating demands for high-end circuit boards, such as those used in AI server PCBs and IC substrates. Having successfully undergone rigorous technical testing, the equipment has garnered recognition from leading domestic server PCB manufacturers. Consequently, Mingyi Electronics has secured multiple orders for this equipment, and the production line is now in full swing, moving into the production and delivery stage.