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Institution: CoWoS-L Anticipated to Dominate as Primary AI Chip Packaging Solution Through 2028
3 hour ago /
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Author：小编
According to TrendForce's most recent research, as GPU manufacturers and hyperscale cloud service providers persist in their pursuit of developing AI chips that are both more powerful and versatile, the trajectory of 2.5D packaging technology development is centered on expanding the packaging area. Despite the emerging competition posed by Intel's EMIB-T, TSMC's CoWoS-L packaging technology is projected to maintain its position as the predominant packaging solution for AI chips up to 2028, primarily due to its technological sophistication and superior production yields.
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