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TrendForce: CoWoS-L is Expected to Remain the Mainstream Packaging Solution for AI Chips by 2028
3 hour ago /
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Author：小编
On September 18, TrendForce's latest research on the semiconductor advanced packaging industry revealed that as GPU manufacturers and hyperscale cloud service providers continue to develop more powerful and versatile AI chips, the focus of 2.5D packaging technology development lies in expanding the packaging area. Among them, TSMC's CoWoS-L technology, despite facing competition from Intel's EMIB-T, is expected to remain the mainstream packaging solution for AI chips by 2028 due to its technological maturity and yield advantages.
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