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Yoozoo Games Initiates Advanced Packaging Project, Propelling AI Industry Ecosystem Development
3 hour ago /
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Author：小编
On September 16, the advanced packaging project spearheaded by Dijiang Technology, in collaboration with Yoozoo Games, was officially launched in Shanghai. Dijiang Technology, a company specializing in 2.5D/3D advanced packaging solutions, is set to establish a large-scale production line in stages. This initiative aims to offer comprehensive, one-stop mass production foundry services tailored for high-performance computing chips, including those used in AI applications and memory devices. This move signifies Yoozoo Games' continued and deepened commitment to bolstering the computing power infrastructure within the AI industry ecosystem.
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