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Taili Technology: Semiconductor CMP Polishing Fluid Still Undergoing R&D Verification
8 hour ago /
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Author：小编
On September 17, Taili Technology announced via an interactive platform that its semiconductor CMP (Chemical Mechanical Planarization) polishing fluid is presently in the R&D verification phase. Consequently, the company is currently unable to ascertain the specific delivery volumes and timelines. Given the extended verification cycles typically required by semiconductor material customers, there remains a degree of uncertainty surrounding whether the product will be available for mass supply and the precise timing of its market introduction.
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