Search
On September 15, as the third quarter progresses into its latter half, TSMC’s production capacities for its advanced 3nm and 2nm manufacturing processes, along with its CoWoS advanced packaging solutions, remain in short supply. According to sources from the supply chain, industry giants such as NVIDIA and Apple are continuing to heavily utilize TSMC’s advanced manufacturing processes and packaging resources. Concurrently, Amazon AWS has ramped up its tape-out volume for AI chips developed in-house, with its Annapurna division securing additional 3nm production capacity. Beyond mobile phone chips, MediaTek is also aggressively pursuing 2nm and 3nm manufacturing processes, as well as CoWoS-S and CoWoS-L packaging capacities, driven by a substantial order from Google TPU.
-
C114 Communication Network -
Communication Home
