Two Departments Collaborate to Drive Full-Chain Technological Advancements in Integrated Circuits
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Author:小编   

On September 15th, reports surfaced indicating that the Ministry of Industry and Information Technology, in conjunction with the National Development and Reform Commission, has recently unveiled the '15th Five-Year Plan' for the Development of the Electronic Information Manufacturing Industry. This comprehensive plan explicitly outlines a commitment to fostering technological innovations that span the entire integrated circuit supply chain. A key focus lies in the development of high-end products, including high-performance processors, high-density memory, and highly reliable analog and mixed-signal chips, which are pivotal for advancing the electronics sector.

Simultaneously, the plan underscores the importance of refining the manufacturing processes of integrated circuits. It calls for the optimization of mature techniques while bolstering research and development efforts aimed at pioneering advanced processes. This dual approach is designed to ensure that the industry remains at the forefront of technological progress.

Moreover, the plan places significant emphasis on promoting the advancement and application of cutting-edge packaging and testing technologies. By doing so, it aims to elevate the quality and upgrade the capabilities of the wide-bandgap semiconductor industry. A particular focus is on expediting the industrialization of ultra-wide-bandgap semiconductors, such as gallium oxide and diamond, which hold immense potential for future electronic applications.

Additionally, the plan advocates for the continuous enhancement of the supply capacity of critical equipment, materials, and components. It also highlights the need to accelerate the development of electronic design automation tools (EDA) and intellectual property cores (IP cores), which are essential for streamlining the design and manufacturing processes of integrated circuits. Furthermore, the plan encourages breakthroughs and applications in pioneering technologies, such as three-dimensional integration, which promise to revolutionize the industry by enabling more compact, efficient, and powerful electronic devices.