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TSMC Plans to Double CoWoS Advanced Packaging Capacity by 2028
9 hour ago /
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Author：小编
The global demand for artificial intelligence and high-performance computing (HPC) chips has surged, leading to delivery bottlenecks for TSMC. According to semiconductor supply chain sources and authoritative industry reports, TSMC plans to aggressively expand its production capacity over the next few years, aiming to more than double its core CoWoS advanced packaging capacity by 2028. With existing capacity already fully booked by giants like NVIDIA and demand outstripping supply, a significant number of advanced packaging orders for AI chips are accelerating towards Intel and Taiwanese packaging and testing foundries.
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