TSMC is ramping up efforts on its 1.4nm process technology. It is anticipated that its wafer fabrication plant in Taichung will kick off trial production in April 2027 and transition to mass production in the latter half of the same year. This represents a significant advancement, with production commencing a full year earlier than initially planned. At present, the steel framework construction of the first factory building has been finalized, with overall completion anticipated by early 2027. Meanwhile, the foundational concrete work for the second factory building has been wrapped up, with the entire structure expected to be completed by October 2027. TSMC has made a substantial investment of approximately US$49 billion in the construction of related facilities and has ambitious plans to establish four 1.4nm wafer factories. The A14 process leverages a second-generation nanosheet transistor architecture, delivering enhanced performance compared to the N2 process. It lays a more sophisticated manufacturing groundwork for a wide array of applications, including smartphones, AI, high-performance computing, and other cutting-edge domains.