On September 8, Manz Asia Intelligence Technology, a semiconductor equipment company based in Suzhou, unveiled a strategic partnership with SUSS, a renowned global provider of semiconductor process solutions. The duo will zero in on pivotal scenarios within semiconductor manufacturing and advanced packaging, working hand-in-hand to devise next-generation inkjet printing turnkey technical solutions. A special focus will be placed on surmounting hurdles in technology research and development, as well as adapting to mass production, thereby propelling the widespread commercialization of inkjet printing processes in the semiconductor realm. Earlier, Manz Asia Intelligence Technology achieved a milestone by successfully delivering the world's inaugural 310mm×310mm panel-level packaging ECD mass production equipment in June 2026. It also established a comprehensive mass production platform encompassing various sizes, including 310mm, 510mm, and 700mm, thereby solidifying its foothold in the advanced packaging equipment market. This collaboration is set to further amalgamate the technological prowess of both entities and expedite the commercialization of crucial processes in semiconductor manufacturing.