On September 7th, news emerged that SK Hynix is ramping up efforts to expand its production capacity share for the sixth-generation 10nm-class DRAM process, known as 1c nm. Given that 1c DRAM will serve as the foundational chip for stacking HBM (High Bandwidth Memory) and for next-generation high-bandwidth memory solutions, the company is accelerating its transition to this new process. According to industry insiders, SK Hynix has seen its market share for 1c DRAM surge from around 10% in the first quarter of this year to 13% in the second quarter. This upward trajectory is projected to continue, with expectations of reaching 24% in the third quarter and 34% in the fourth quarter. By the first quarter of next year, the market share of 1c nm is anticipated to climb to approximately 35%, surpassing that of 1b (which stands at around 33%) for the first time and establishing itself as the mainstream process.