The development of TSMC's 1.4nm wafer fabrication plant in the Central Taiwan Science Park is progressing ahead of schedule. The project, backed by a substantial total investment of $49 billion, was initially slated to break ground in November 2025. The plant is projected to complete its initial silicon wafer trial runs by April 2027. Should the construction maintain its current momentum, the first phase of trial production is set to commence in the third quarter of the same year. Following successful validation, full-scale mass production is anticipated to kick off in mid-2028.