Intel’s pre-market stock price witnessed a notable uptick of 3.5%, climbing to $94.19. The tech giant is forging ahead with the development of its sprawling 1,000-acre wafer fabrication campus in Ohio, with the ambitious goal of achieving full operational status by 2031 and ramping up mass production of its cutting-edge 14A process technology. To expedite the construction timeline, Intel is incentivizing its workforce with generous overtime bonuses.

Intel’s EMIB-T advanced packaging technology, renowned for its cost-efficiency, is priced approximately 50% lower than TSMC’s CoWoS solution. This innovative technology is anticipated to hit the market on a large scale by 2027. Presently, the packaging technology itself boasts a yield rate close to 90%. However, the yield of the substrates—a crucial component—hovers around the 50% mark, presenting a significant bottleneck in scaling up production capacity. In response, relevant suppliers are diligently striving to enhance both capacity and yield to meet the burgeoning demand.