SiHui Fushi Aims to Secure Up to 930 Million Yuan for Project Investment, Venturing into High-Multi-layer and HDI Circuit Board Sectors
8 hour ago / Read about 0 minute
Author:小编   

On July 22, 2026, SiHui Fushi unveiled its revised draft of the 2026 annual plan for the issuance of A-share stocks to specific investors, outlining a proposal to raise a maximum of 930 million yuan. This funding is earmarked for the annual production of 600,000 square meters of high-multi-layer and HDI circuit boards (Phase I). The number of shares slated for issuance in this round is capped at 48,156,349, ensuring that the company's control remains unchanged post-issuance. Nevertheless, potential risks loom, encompassing regulatory approval, the successful execution of the stock issuance, the implementation of the funded investment project, and the possibility of returns falling short of expectations.