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Samsung Postpones Mass Production of HBM Chips with Hybrid Bonding Technology to Sync with NVIDIA's 2029 GPU Launch
13 hour ago /
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Author：小编
Samsung is poised to initiate the mass production of HBM chips, employing cutting-edge hybrid bonding technology, in 2029. This strategic move is timed to align perfectly with the release of NVIDIA's next-generation Feynman AI GPU. Hybrid bonding represents a significant leap forward in HBM manufacturing, as it obviates the need for microbumps between DRAM layers, thereby minimizing interlayer spacing. When compared to the conventional microbump connections, hybrid bonding facilitates a more seamless integration of chip layers, culminating in accelerated data transfer rates and reduced power consumption. This technology is widely recognized as the trajectory for the future evolution of HBM.
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