Intel has recently introduced its cutting-edge aerospace-grade AI chip, named "Starfire," which is crafted utilizing the advanced 18A manufacturing process. This chip boasts 8 cores and is engineered to last beyond a decade, thriving in extreme conditions with temperature resilience from -55℃ to 125℃, as well as withstanding the harsh environments of space radiation. The "Starfire" chip comes in two configurations: a 10W low-power model and a 35W high-performance variant. The low-power iteration offers an impressive 45 TOPS (Tera Operations Per Second) of AI computing capability, whereas the high-performance version escalates this to 75 TOPS. Both iterations are outfitted with 4 Xe3 integrated graphics cores. Leveraging multi-chip Foveros packaging technology, "Starfire" ensures compatibility with both LPDDR5 and DDR5 memory standards. Sampling of this innovative chip is slated for the third quarter of 2026, with its primary focus directed towards U.S. government and military endeavors, rather than venturing into the civilian market sphere.