Scientists from the Korea Institute of Industrial Technology and Pohang University of Science and Technology have jointly developed a novel chip stacking process capable of stably stacking more than 10 ultrathin semiconductor chips, each just 14 micrometers thick, achieving an integration density approximately four times higher than that of commercial high-bandwidth memory (HBM). By integrating transfer printing with real-time bonding processes, this technology enables precise chip stacking and electrical interconnection under low-temperature and low-pressure conditions, effectively addressing the challenges of bending and fracture in ultrathin chips. The research findings have been published in the journal Engineering Results, providing a critical technological pathway to alleviate memory bottlenecks in the growing demand for AI computing power, with potential applications extending to advanced packaging and microdisplay fields in the future.