On July 1, 2026, Samsung Electronics convened its annual SAFE Forum in Seoul, South Korea. At this significant event, the company announced a thorough reinforcement of collaboration throughout the AI semiconductor supply chain and disclosed its roadmap for next-generation foundry technology. Samsung unveiled a fresh strategy, dubbed 'Nexus,' which is designed to forge an open and collaborative ecosystem by linking products, infrastructure, software, and customers together seamlessly. In the realm of process technology, Samsung affirmed that its inaugural 1.4nm process, SF1.4, will commence mass production in 2029. This will be succeeded by an enhanced iteration, SF1.4+, in 2030. Regarding the 2nm process, the launch of SF2P+ has been rescheduled for the 2027-2028 period, to be followed by the IP-compatible SF2X. Samsung underscored the pivotal role of Design-Technology Co-Optimization (DTCO) in substantially boosting the energy efficiency and performance enhancements of the 2nm process. Moreover, the company is actively partnering with ecosystem collaborators to broaden the 4nm IP library and devise novel 2nm IP. Furthermore, Samsung shared the latest advancements on HBM4, revealing that its base chips are being fabricated using the 4nm process SF4X. The company also showcased groundbreaking technologies, such as automated chip interconnection design flows, which promise to revolutionize the industry.