The Xingang Integrated Wafer Manufacturing Project in the Lingang Special Area of Shanghai Officially Commences Construction
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Author:小编   

On June 30th, it was reported that the Xingang Integrated Project in the Lingang Special Area held a groundbreaking ceremony in Xinlu Village, Wanxiang Town on June 29th. Founded in November 2025, Shanghai Oriental Xingang Integrated Circuit Co., Ltd. (hereinafter referred to as "Xingang Integrated") has an initial registered capital of US$5.5 billion, with plans for subsequent capital increases. The first phase of the project, covering a total construction area of approximately 620,000 square meters, will focus on the research, development, and manufacturing of 55nm-28nm planar process integrated circuits, providing foundry services to global clients. Construction for the first phase is expected to commence in the third quarter of 2026, with delivery scheduled before the end of 2027.

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