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TSMC's Order Ranking: NVIDIA Leads, AMD Follows Closely
18 hour ago /
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Author：小编
Morgan Stanley's latest research report points out that in the competition for TSMC's CoWoS advanced packaging capacity, NVIDIA will remain the largest customer until 2027. NVIDIA's AI GPUs, such as Blackwell and Rubin, utilize TSMC's CoWoS-L packaging, with an expected production capacity of 910,000 units by 2027, representing a 40% year-on-year increase. Its Vera CPU, packaged with CoWoS-R, is expected to double in shipments.
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