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Intel in Talks with Amazon and Google for AI Chip Packaging
1 day ago /
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Author：小编
According to reports, Intel is engaged in ongoing discussions with at least two major clients, including Amazon and Google, regarding its advanced packaging services. The rapid development of artificial intelligence technology has driven demand for advanced chip packaging. Naga Chandrasekaran, head of Intel's foundry business, stated that advanced packaging technology could profoundly transform the AI field over the next decade.
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